Efficiently Utilized Energy 

by Power Chiplet Devices

Current Domain

The array of small power conversion cells with small current forms large current power delivery capability

Voltage Domain

A cascaded power structure design converts a power source at a different volage level by standardized blocks in series to achieve the highest efficiency in the industry 

Temperature Domain

The highly distributed power delivery controls the conversion density by temperature profiling in the dynamic thermal mapping 

IVy-ChipletTM Solutions

Power delivery is becoming vastly more complex in AI systems, EV automobiles as demand for electricity grows and decarbonisation efforts ramp up. In power consumption, AI and EV are the new power couple in both spectrums of voltage and current. In these systems, the CPU, GPU and ASIC devices need current up to a level of exceeding a thousand amperes. The voltage conversion ratio from voltage input ports to the points of consumption load is up to several hundreds to one. This trend of system needs poses substantial challenges to the power delivery designs in power conversion efficiency, thermal conduction and power integrity.     

 

MaxEpic develops a unique technology and solution in its power delivery semiconductor devices to fundamentally revolutionize the power delivery design for a wide spectrum of voltage and current. Its IVy-ChipletTM solutions manage the power conversion in 3 domains – current domain, voltage domain and temperature domain to achieve the highest efficiency and density.